What is a BGA rework machine?
Rework (or re-work) is the term for the refinishing operation or repair of an electronic printed circuit board (PCB) assembly, usually involving desoldering and re-soldering of surface-mounted electronic components (SMD).
What is a BGA chip?
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.
Reasons for rework of electronics include:
• Poor solder joints due to faulty assembly or thermal cycling.
• Solder bridges—unwanted drops of solder that connect points that should be isolated from each other.
• Faulty components.
• Engineering parts changes, upgrades, etc.
Properly carried out rework restores the functionality of the reworked assembly, and its subsequent lifetime should not significantly be affected. Consequently, where the cost of reworking is less than the value of the assembly, it is widely used in all sectors of the electronic industry. Manufacturer and service providers of communications-technologies, entertainment- and consumer-devices, industrial commodities, automobiles, medical technology, aerospace and other high power electronics rework when necessary.